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This Safety Guideline applies to atmospheric and vacuum wafer-handling robots that are manufactured with their supplier’s intention that they be integrated into semiconductor manufacturing equipment
1節）的補充用
It stresses the impact of the IC and end product requirements
This Standard provides guidelines for both the process of developing and delivering equipment training that is performance-based
Federal Communications Commission (FCC))
G10400 - SEMI G104 - Specification for Wettability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging Revision:SEMI G104-1122 - Current This Safety Guideline applies toMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics to use for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular, and sheet material are used for WLP and PLP and these materials require the different characteristics and performances. The
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