F02000 - SEMI F20 - 用于通用、高纯和超高纯半导体制造组件的316L不锈钢棒材、锻材、挤压型材、板材和管材的规范 Revision:SEMI F20-0706E (Reapproved 0917) - Superseded SEMI E82-0704 (technical revision)

SEMI E82-0704 (technical revision)

The design and acceptance criteria may be used for metal lid/preform assemblies used on all types of semiconductor packages

This Specification does not require that the metadata provided by the equipment be directly human readable

1  The purpose of this Specification is to establish basic physical dimensions for the large tray stack FOUP (LTSF) intended to be used to transport and store JEDEC BX trays

This Practice may also be applied to detection of defects in epitaxial layers

F02000 - SEMI F20 - 用于通用、高纯和超高纯半导体制造组件的316L不锈钢棒材、锻材、挤压型材、板材和管材的规范 Revision:SEMI F20-0706E (Reapproved 0917) - Superseded SEMI E82-0704 (technical revision)NOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. 316L ASTM A276ASTM A240ASTM A269ASTM A632316L