M06700 - SEMI M67 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Thickness Data Array Using the ESFQR, ESFQD, and ESBIR Metrics Revision:SEMI M67-1108 - Superseded This guide was technically approved

This guide was technically approved by the global Flat Panel Display Committee and is the direct responsibility of the North American Flat Panel Display Committee

As this communication concept is adopted by the various FPU suppliers and their customers

a conventional pellicle film cannot be placed in front of EUVL reticles

SEMI E125-0923 (technical revision)

It is intended that HSMS be supplemented by Subordinate Standards which further specify details of its use or impose restrictions on its use in particular application domains

M06700 - SEMI M67 - Test Method for Determining Wafer Near-Edge Geometry from a Measured Thickness Data Array Using the ESFQR, ESFQD, and ESBIR Metrics Revision:SEMI M67-1108 - Superseded This guide was technically approvedWafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer determine if the dimensional characteristics of a wafer satisfy given geometrical requirements. This Test Method is suitable for quantifying the flatness aspects of near edge geometry of wafers used in semiconductor device processing. The ESFQR, ESFQD or ESBIR metric may be