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MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0306 - Superseded SEMI E69 — Test Method

SKU: 89940166773
4.1

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SEMI E69 — Test Method for Determining Reproducibility and Zero Drift for Thermal Mass Flow Controllers

sensitivity to field-related problems increases

This Guide provides recommendations to help assure that facility static charge limits are appropriate for the product being manufactured

SEMI M1-0211 (technical revision)

SEMI S8-0307E (editorial revision)

MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0306 - Superseded SEMI E69 — Test Method1 Purpose 1. 1 This Guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together. 2 Scope 2. 1 This Guide applies to targets that can be used with two common alignment processesinner surface alignment and outer surface alignment. 2. 2 This Guide

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