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G04200 - SEMI G42 - 半導体パッケージのジャンクション部と周囲間の熱抵抗測定用標準熱抵抗測定基板の仕様 StdTpc-Equipment Process Control calibration procedures

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Description

calibration procedures

1  This Guide contains definitions of terms which describe the effects of temperature upon mass flow controllers as used in the semiconductor industry

This Standard specifies the concepts

and quality assurance requirements for high purity quality electropolished 316L stainless steel tubing

注意: 本文書は,編集上の修正を伴い再承認された。

G04200 - SEMI G42 - 半導体パッケージのジャンクション部と周囲間の熱抵抗測定用標準熱抵抗測定基板の仕様 StdTpc-Equipment Process Control calibration proceduresglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1986200411 : Referenced SEMI Standards SEMI G32 Guideline for Unencapsulated Thermal Test Chip SEMI G38 Test Method for Still and Forced Air Junction to Ambient Thermal Resistance Measurements of Integrated Circuit Packages

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