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global Flat Panel Display ― Materials & Components Committeeで技術的に承認されている。現版は2012年12月20日，global Audits and Reviews Subcommitteeにて発行が承認された。2013年2月にwww
SEMI D25 ¾ Specification for Flat Panel Display Substrate Shipping Case
UPW parameters
• the purity of the gases used for mixture preparation
it may not be enough to sustain adequate stiffness of the wafer
3D00600 - SEMI 3D6 - Guide for CMP and Micro-Bump Processes for Frontside Through Silicon Via (TSV) Integration StdPbc-1015 global Flat Panel Display ―In order to speed up volume production of 3DS IC products, a generic middle end process flow is needed to communicate the frontend and backend processes. The quality criteria and metrology methodology of the key modules such as TSV, chemical mechanical planarization (CMP), and micro bump are developed to ensure high yield of the middle end process. Therefore, this guide provides a generic middle end process flow to define acceptable TSV and CMP
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