T02300 - SEMI T23 - Specification for Single Device Traceability for the Supply Chain Revision:SEMI T23-0420 - Current SEMI MF1391-93 (Reapproved 2000) (first

SEMI MF1391-93 (Reapproved 2000) (first SEMI publication)

to alert the reader to related issues that may arise in user-specific applications

2  The general trend in wafer geometry is to a larger diameter but even so the thickness increases correspondingly

Subordinate Standard:

) approximately and larger in thickness

T02300 - SEMI T23 - Specification for Single Device Traceability for the Supply Chain Revision:SEMI T23-0420 - Current SEMI MF1391-93 (Reapproved 2000) (firstThis Document establishes a standardized approach for enabling traceable device ID throughout the IC manufacturing, test, and assembly processes to the point of use in the final system. Suppliers and board level manufacturers can use this unique identifier to communicate about a specific device for the purposes of performance or failure analysis. The unique identifier will enable the ability to send manufacturing data back and forward through the