3D00300 - SEMI 3D3 - Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames StdPbc-1114 SEMI C20-0213 (technical revision)

SEMI C20-0213 (technical revision)

It is an aqueous immersion method in an acidified ferric chloride solution

to assure that a gas is suitable for the common uses to which it may be put in the manufacture and processing of semiconductor devices and

for instance wafers or sheets

The edge lengths specified range from 300 × 300 mm to 500 × 500 mm

3D00300 - SEMI 3D3 - Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames StdPbc-1114 SEMI C20-0213 (technical revision)This Guide provides the user with information about containers needed to ship thin wafers that are mounted on dicing tape to tape frames conforming to either SEMI G74 or SEMI G87. This Guide covers the shipping of 300 mm nominally diameter silicon wafers. The actual diameter of a 300 mm (nominal) silicon wafer may be less than 300 mm due to material removal via edge trim; the diameter of 300 mm silicon wafers fabricated specifically for use as carrier