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2 These test methods can be applied in research and development
This Specification does not define any new behavior required of the equipment other than that necessary for retrieving information describing equipment configuration
which can make applicability of the standards more widely
The front surface of the wafer is mirror polished and the back surface may be as-cut
self-interstitials and their complexes)
S01100 - SEMI S11 - 半導體製造設備微環境之安全及衛生基準 Revision:SEMI S11-1296 (Withdrawn 1106) - Withdrawn - Historical 2 These test methods canSEMI S23. 1 These guidelines are intended as a minimum set of performance based environmental, health, and safety considerations for minienvironments used in semiconductor manufacturing. These guidelines are intended to be a supplement to SEMI S2. These guidelines apply to minienvironments used in the manufacturing, metrology, assembly, and testing of semiconductor products. Equipment enclosed by, or used in conjunction with, the minienvironments is
