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The results obtained may differ significantly from those obtained with the specified oxidation cycles
This Document describes cassettes that are used with glass substrates in the fabrication and processing of subassemblies and masks for flat panel displays (FPD)
SEMI C3 — Specification for Gases
SEMI M10 — Terminology for Identification of Structures and Features Seen on Gallium Arsenide Wafers
Alternative methods may also be used as long as they comply with SEMI C1 requirements for method validation
G07700 - SEMI G77 - Specification for Frame Cassette for 300 mm Wafers StdTpc-Wafer Shipping System The results obtained may differThe purpose of this Standard is to specify the mechanical features for a 300 mm wafer frame cassette used between the wafer mounting process and the die bonding process. This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. Only the physical interfaces for the frame cassette are specified; no materials requirements
